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Effect of cooling rate on the thermoelectric and mechanical performance of Bi0.5Sb1.5Te3 prepared under a high magnetic field
Affiliation:1. Division of Advanced Materials Engineering, Kongju National University, 331-717, South Korea;2. Metals Development, Ames Laboratory, Iowa State University, 5001, USA;3. Department of Materials Science and Engineering, University of Central Florida, Orlando, FL 32816, USA;1. Department of Applied Physics and Institute of Natural Sciences, Kyung Hee University, Yongin 17104, South Korea;2. Department of Fusion Chemical Engineering, Hanyang University, Ansan 15588, South Korea;1. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China;2. School of Physics and Technology, Wuhan University, Wuhan 430072, China;1. Institute of Materials Engineering, National Taiwan Ocean University, Keelung 20224, Taiwan;2. China Steel Cooperation, Kaoshung, Taiwan;3. Institute of Materials Science and Engineering, Department of Mechanical Engineering, National Central University, Chung-Li 32001, Taiwan
Abstract:Given the thermoelectric and mechanical performance of a given material is closely related to its microstructure, in this paper, the microstructure of p-type Bi0.5Sb1.5Te3, fabricated by a high magnetic field assisted melting-solidification (HMAMS) process, is successfully tuned by regulating the cooling rate during the solidification process, and a systematic investigation has been carried out to the effect of the cooling rate on the crystal orientation, microstructure, thermoelectric and mechanical performance of the obtained materials. By this approach, the thermal conductivity is sharply reduced due to the intensive phonon scattering by the massive BST/Te and Te/BST interfaces, while the power factor is less affected, and the flexural strength is enhanced owing to the narrowing of eutectic strip and spacing. Eventually, a highest ZT of 1.23 at 323 K with a maximal flexural strength 23.2 MPa has been obtained in the sample prepared under a 6 T magnetic field at a cooling rate of 16 K/min.
Keywords:Thermoelectric  Microstructure  Seebeck coefficient
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