Design,preparation and properties of online-joints of C/SiC–C/SiC with pins |
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| Affiliation: | 1. National Key Laboratory of Science and Technology on Advanced Ceramic Fibers and Composites, College of Aerospace and Materials Engineering, National University of Defense Technology, Changsha 410073, Hunan Province, China;2. Plant 8603, The Fourth Institute of China Aerospace Science and Technology Corporation, Xiaogan 432100, Hubei Province, China;1. State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xian, Shaanxi, 710049, China;2. Engineering Laboratory of Advanced Energy Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, Zhejiang, 315201, China;3. State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, 200050, China;1. State Key Laboratory for Strength and Vibration of Mechanical Structures, School of Aerospace Engineering, Xi’an Jiaotong University, Xi’an, 710049, China;2. School of Aeronautics, Northwestern Polytechnical University, Xi’an, 710072, China;3. Science and Technology on Thermostructural Composite Materials Laboratory, Xi’an, 710072, China;4. Joint International Research Laboratory of Impact Dynamics and its Engineering Application, Xi’an, 710072, China;5. Shaanxi Key Laboratory of Impact Dynamics and its Engineering Application, Xi’an, 710072, China |
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| Abstract: | This work is aimed at providing a new joining technology for C/SiC composites and investigating the influence of drilling holes, hole distribution (including ratios of edge distance to diameter (E/D), width to diameter (W/D) and hole distance to diameter (H/D)) and the number of applied pins on the mechanical properties of C/SiC substrates and joints. The mechanical testing results show that drilling holes and hole distribution greatly affects the mechanical properties of C/SiC substrates but when adopting an optimized design principle (E/D ⩾ 3, W/D ⩾ 3 and H/D ⩾ 3) the effect could be neglected. 1D C/SiC pins with higher shearing strength (107.2 MPa) are more suitable to join the substrates. With the increase of pins (1, 2 and 4), the bearing loads of the joints increase almost linearly, and the reliability of joints is also improved in that the fracture mode changes from the interlayer damage to the substrate rupture. Besides, the joining process generates uniform and dense joining layer (composition of ZrC and SiC) and a strong bonding without obvious interface. |
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