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Cure kinetics characterization and monitoring of an epoxy resin using DSC,Raman spectroscopy,and DEA
Affiliation:1. Department of Industrial and Manufacturing Systems Engineering, Iowa State University, Ames, IA 50011, USA;2. Department of Chemical and Biochemical Engineering, University of Iowa, Iowa City, IA 52242, USA;3. Department of Materials Science and Engineering, Iowa State University, Ames, IA 50011, USA;4. Department of Mechanical Engineering, Iowa State University, Ames, IA 50011, USA;5. Ames Laboratory, Department of Energy, Ames, IA 50011, USA;1. Tomas Bata University in Zlin, Faculty of Technology, Centre of Polymer Systems, nam. T.G. Masaryka 5555, CZ-760 01 Zlin, Czech Republic;2. Bonn-Rhein-Sieg University of Applied Sciences, Department of Natural Sciences, von Liebig Str. 20, D-53359 Rheinbach, Germany;1. Kompetenzzentrum Holz GmbH, Altenbergerstraße 69, 4040 Linz, Austria;2. Fritz Egger GmbH & Co OG, Tiroler Straße 16, Unterradlberg 3105, Austria;3. NETZSCH-Gerätebau GmbH, Wittelsbacherstraße 42, 95100 Selb/Bayern, Germany
Abstract:The use of thick sections of fiber-reinforced polymers (FRPs) is increasing for numerous industrial applications such as wind turbine blades. In situ cure monitoring is very important to directly observe the cure process of FRPs during the manufacturing process. In this work, Raman spectroscopy and dielectric analysis (DEA) are investigated for in situ cure monitoring of an epoxy resin. The cure behavior is first characterized using differential scanning calorimetry (DSC) as a baseline comparison, and the best-fit phenomenological reaction model is determined to describe the cure behavior of the epoxy resin as well as the kinetic parameters. The relationship between Tg and degree of cure is also established. The degree of cure obtained from Raman spectroscopy and DEA under isothermal conditions is compared to that obtained from DSC. A good agreement is observed among the three methods, supporting the potential of these in situ cure monitoring methods during manufacturing. An implementation plan for in-plant monitoring is also discussed.
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