Simulation of void formation in liquid composite molding processes |
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Affiliation: | 1. School of Aerospace Engineering and Applied Mechanics, Tongji University, 1239 Siping Road, Shanghai 200092, PR China;2. Key Laboratory of Advanced Civil Engineering Materials, Ministry of Education, PR China;1. University of Delaware, USA;2. TECHCENTER FAURECIA SEATING, Etampes, France;3. ENSAM ParisTech, France;1. Uppsala University, Department of Engineering Sciences, Division of Applied Mechanics, SE-75121 Uppsala, Sweden;2. GKN Aerospace, SE-46181 Trollhattan, Sweden;3. Materials Research Group, Faculty of Engineering and the Environment, University of Southampton, Southampton, United Kingdom;4. Manufacturing Engineering Technology, Brigham Young University, Provo, UT 84602, USA |
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Abstract: | Air entrapment within and between fiber tows during preform permeation in liquid composite molding (LCM) processes leads to undesirable quality in the resulting composite material with defects such as discontinuous material properties, failure zones, and visual flaws. Essential to designing processing conditions for void-free filling is the development of an accurate prediction of local air entrapment locations as the resin permeates the preform. To this end, the study presents a numerical simulation of the infiltrating dual-scale resin flow through the actual architecture of plain weave fibrous preforms accounting for the capillary effects within the fiber bundles. The numerical simulations consider two-dimensional cross sections and full three-dimensional representations of the preform to investigate the relative size and location of entrapped voids for a wide range of flow, preform geometry, and resin material properties. Based on the studies, a generalized paradigm is presented for predicting the void content as a function of the Capillary and Reynolds numbers governing the materials and processing. Optimum conditions for minimizing air entrapment during processing are also presented and discussed. |
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Keywords: | A. Preform C. Numerical analysis E. Resin flow Void formation |
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