某高热耗及高热流密度风冷散热热设计与优化

随着大功率器件的普及，单点热耗高且热流密度大的问题越发突出。以往的解决方法都采用液冷散热，但液冷散热相较于风冷散热存在设备量大、成本高等缺点。文中探讨采用风冷散热解决单点热耗高且热流密度大的问题，使风冷散热方式在高热耗、高热流密度工程上得到应用。通过仿真分析，采用蒸汽腔（Vapor Chamber, VC）均温板并进行风冷冷板结构参数优化，达到减小传热路径上各热阻的目的，从而设计出了满足散热要求的风冷冷板。装机后对实物进行测试，验证了风冷散热在高热耗、高热流密度散热问题上的可行性。

Thermal Design and Optimization of an Air Cooling with High Heat Consumption and High Heat Flux Density

As the use of high-power devices becomes more and more popular, the problems of high single-point heat consumption and high heat flux density have become more prominent. In the past, liquid cooling is used to solve this problem. But compared with air cooling, liquid cooling has the disadvantages such as a lot of equipment and high cost. This article discusses the use of air cooling for dealing with the coexistence of high heat consumption and high heat flux density, so that air cooling can be applied in high heat consumption and high heat flux projects. Through simulation analysis, the vapor chamber (VC) uniform temperature plate is adopted and the structural parameter optimization of air-cooled cold plate is carried out to reduce each thermal resistance on the heat transfer path. Thus, an air-cooled cold plate that meets the heat dissipation requirement is obtained. The physical test after installation proves the feasibility of air cooling in solving the problem of high heat consumption and high heat flux density.