六方氮化硼导热复合材料研究进展

随着电子元器件、电力系统和通讯设备等领域的飞速发展，对散热要求也越来越高。六方氮化硼是一种性能优异的绝缘导热填料，其导热复合材料受到了越来越多的关注。该文综述了近年来关于六方氮化硼基导热复合材料的研究进展，简要介绍了其导热机理和研究现状，进一步总结了当前存在的一些技术困难，并展望了未来六方氮化硼基导热复合材料的发展方向。

Research Progress on Hexagonal Boron Nitride-Based ThermalConductive Composites

Rapid development of electronic devices, power systems and communication equipments presentan increasing requirement for the heat dissipation. Hexagonal boron nitride (h-BN) is very useful as aninsulating and thermal conductive filler, and more and more attentions have been paid to its thermal conductivecomposites. In this article, we focus on the detail progress of h-BN-based thermal conductive composites,including thermal transfer mechanism and present situation. Furthermore, some current technical defects anddifficulties are summarized, and the future developing trend of h-BN-based thermal conductive composites isalso prospected.