| Microstructure of Si3N4/Si3N4 joint brazed using Cu-Pd-Ti alloy filler |
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| 引用本文： | 张杰,N.Massaki,周玉. Microstructure of Si3N4/Si3N4 joint brazed using Cu-Pd-Ti alloy filler[J]. 中国有色金属学报, 2004, 14(Z2): 98-100 |
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| 作者姓名： | 张杰 N.Massaki 周玉 |
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| 作者单位： | ZHANG Jie(张杰)（Scholl of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China） N. Massaki（Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567- 0047, Japan） ZHOU Yu(周玉)（Scholl of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China） |
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| 基金项目： | 哈尔滨工业大学校科研和教改项目 |
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| 摘 要： |
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| 文章编号： | 1004-0609(2004)S3-0098-03 |
Microstructure of Si3 N4/Si3 N4 joint brazed using Cu-Pd-Ti alloy filler |
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| N.Massaki. Microstructure of Si3 N4/Si3 N4 joint brazed using Cu-Pd-Ti alloy filler[J]. The Chinese Journal of Nonferrous Metals, 2004, 14(Z2): 98-100 |
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| Authors: | N.Massaki |
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| Abstract: | Microstructure of the Si3 N4/Si3 N4 joint brazed using an active filler of Cu-Pd-Ti alloy was analyzed by means of EPMA and XRD. The results indicate that a perfect Si3 N4/Si3 N4 joint is obtained by using an active filler of Cu76.5Pd8.5Ti15 alloy with brazing temperature, pressure and holding time of 1 373 - 1 473 K, 2× 10-3 MPa and 1.8 ks, respectively. The filler alloy in the joint is a Cu-Pd solution containing reactant of TiN, PdTiSi and Pd2Si.The interface between the filler alloy and Si3 N4 ceramic is composed of TiN reactant. |
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| Keywords: | Si3 N4 ceramic Cu-Pd-Ti filler alloy joint microstructure |
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