真空热压烧结SiC_p/Al复合材料的界面元素扩散及增强断裂机理

采用真空热压粉末冶金烧结工艺制备了含SiC颗粒体积分数分别为 5 %、15 %和 2 5 %的SiC颗粒增强铝基复合材料 ,结合其力学性能、扫描电镜和界面微区能谱分析结果 ,分析了SiC/Al复合材料的真空烧结过程中的界面现象 ,以及材料增强和断裂机理。结果表明 ,真空烧结过程中出现了界面反应 ,改善了界面结合强度 ,断裂破坏主要在基体上进行。随着SiC粒子体积分数的增加 ,SiCp/Al复合材料的抗拉强度增加 ,弹性模量显著增加 ,延伸率降低 ,材料脆性增加。

Element Diffusion on Interface and Reinforcing and Fracture Mechanisms of SiCp/Al Composites by Vacuum Hot-Pressing Sintering Processing

SiC p particular reinforced Al matrix composite s, with 5%,15% and 25% volume fraction content of SiC particles, were prepared by vacuum hot-pressing sintering processing in this paper. Based on mechanics perf ormance, SEM pictures and energy spectrum on interface tiny region, interface re action phenomenon of SiC p/Al composite by vacuum hot-pressing sintering, reinforcment and fracture mechanisms were analyzed. The results show that interf ace element diffusion and reaction on interface in vacuum hot-pressing sinterin g processing improved interface strength. Fracture occurred mainly in Al matrix. The tensile strength and elasticity module of SiC p/Al composite were incr eased with the volume fraction content of SiC particles, but its elongation was decreased, brittleness was increased.