首页 | 本学科首页   官方微博 | 高级检索  
     

多晶硅薄膜晶体管自加热效应温度分布的有限元模拟
引用本文:杨震宇,王明湘,王槐生.多晶硅薄膜晶体管自加热效应温度分布的有限元模拟[J].半导体学报,2008,29(5):954-959.
作者姓名:杨震宇  王明湘  王槐生
作者单位:苏州大学微电子学系,苏州215021
摘    要:采用有限元方法模拟了n型MILC低温多晶硅薄膜晶体管在直流自加热应力下器件的温度分布.通过对器件沟道温度分布的稳态及瞬态模拟,研究了器件功率密度、衬底材料类型和器件宽长等关键因素的影响.确认了改善器件自加热退化的有效途径,同时有助于揭示多晶硅薄膜晶体管自加热退化的内在机制.

关 键 词:有限元分析  温度分布  薄膜晶体管  自加热退化  稳态及瞬态模拟
文章编号:0253-4177(2008)05-0954-06
收稿时间:9/30/2007 5:10:25 PM
修稿时间:2007年9月30日

Finite Element Analysis of Temperature Distribution of Polysilicon TFTsUnder Self-Heating Stress
Yang Zhenyu,Wang Mingxiang and Wang Huaisheng.Finite Element Analysis of Temperature Distribution of Polysilicon TFTsUnder Self-Heating Stress[J].Chinese Journal of Semiconductors,2008,29(5):954-959.
Authors:Yang Zhenyu  Wang Mingxiang and Wang Huaisheng
Affiliation:Department of Microelectronics,Soochow University,Suzhou 215021,China;Department of Microelectronics,Soochow University,Suzhou 215021,China;Department of Microelectronics,Soochow University,Suzhou 215021,China
Abstract:The temperature distribution of typical-sized n-type polycrystalline silicon thin film transistors under self-heating (SH) stress is studied by finite element analysis. From both steady-state and transient thermal simulation, the influence of device power density,substrate material,and channel width on temperature distribution is analyzed.This study is useful for understanding the mechanism of self-heating degradation,and to find approaches to effectively alleviate the SH effect in device operation.
Keywords:FEA  temperature distribution  thin film transistor  self-heating degradation  steady-state and transient simulation
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《半导体学报》浏览原始摘要信息
点击此处可从《半导体学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号