Ti靶电流对CrTiAlN镀层组织结构及硬度的影响

利用磁控溅射技术在高速钢和单晶硅基体上沉积CrTiAlN梯度镀层,研究Ti靶电流对CrTiAlN镀层组织、相结构及硬度的影响.利用EDS、XRD和SEM分析镀层的成分、相结构及形貌,采用显微硬度计测量镀层的硬度.结果表明:随着Ti靶电流的增大,镀层中的Ti原子逐渐置换CrN中的Cr原子形成Cr-Ti-N体系,同时出现少量的TiN相;镀层生长的择优取向由(111)晶面逐渐转变为(200)晶面;镀层柱状晶的结构更为致密,其表面形貌由三棱锥结构逐步变为胞状结构;随Ti靶电流的增大,镀层硬度逐渐由1267HV升至1876HV.

Influence of Ti target current on microstructure and hardness of CrTiAlN coatings prepared by magnetron sputtering

Effect of Ti target current on microstructure, phase structure and hardness of CrTiAliN coatings, which was deposited on high speed steel and silicon wafer substrate by magnetron sputtering, were studied. The composition, phases, morphology of the CrTiAlN coatings were analyzed and observed by EDS, XRD and SEM. Hardness of the coatings was measured by a micro-hardness tester. The results show that with the increase of Ti target current, Ti is gradually substituted for Cr in CrN to form CrTiAlN coatings, which consists of CrN and a small quantity of TiN phase.The preferential orientation of the coatings changes from (111) plane to (200) plane. The surface morphology of the coatings gradually changes from triangular pyramid structure to compacted cellular structure. Hardness of the coatings is improved from 1267HV to 1876HV with the increase of Ti target current.