The high temperature creep deformation of Si3N4-6Y2O3-2Al2O3 |
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| Authors: | J A Todd Zhi-Yue Xu |
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| Affiliation: | (1) Departments of Materials Science and Mechanical Engineering, University of Southern California, 90089-0241 Los Angeles, California, USA;(2) Department of Materials Science, University of Southern California, 90089-0241 Los Angeles, California, USA |
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| Abstract: | The creep properties of silicon nitride containing 6 wt % yttria and 2 wt% alumina have been determined in the temperature range 1573 to 1673 K. The stress exponent, n, in the equation
 
n
was determined to be 2.00±0.15 and the true activation energy was found to be 692±25 kJ mol–1. Transmission electron microscopy studies showed that deformation occurred in the grain boundary glassy phase accompanied by microcrack formation and cavitation. The steady state creep results are consistent with a diffusion controlled creep mechanism involving nitrogen diffusion through the grain boundary glassy phase. |
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