| “无铅”FR-4覆铜板的开发 |
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| 引用本文： | 辜信实. “无铅”FR-4覆铜板的开发[J]. 印制电路信息, 2005, 0(7): 18-20 |
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| 作者姓名： | 辜信实 |
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| 作者单位： | 广东生益科技股份有限公司,523039 |
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| 摘 要： | 重点介绍在“无铅”FR-4覆铜板开发工作中,设计思路、基本配方以及所取得的成果。
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| 关 键 词： | 无铅 耐热 覆铜板 |
Development of FR-4 CCL in Lead-free |
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| Gu Xinshi. Development of FR-4 CCL in Lead-free[J]. Printed Circuit Information, 2005, 0(7): 18-20 |
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| Authors: | Gu Xinshi |
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| Abstract: | This paper describes the achievement of developmental work, designed program, and basic composi-tion in FR-4 CCL of lead-free. |
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| Keywords: | lead-free heat-resisting CCL |
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