In-process detection of microscratching during CMP using acoustic emission sensing technology |
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| Authors: | Jianshe Tang David Dornfeld Suzette Keefe Pangrle Alvin Dangca |
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| Affiliation: | (1) Department of Mechanical Engineering, University of California at Berkeley, 94720-1740 Berkeley, CA;(2) Integrated Technology Division, Advanced Micro Devices Inc., 1160 Kern, 94086 Sunnyvale, CA |
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| Abstract: | An experimental investigation on the correlation between the microscratches and the signal characteristics of acoustic emission
(AE) generated during chemical mechanical planarization (CMP) has been performed. CMP experimental results from both laboratory
and production line CMP machines have clearly showed that AE rms voltage in the time domain has distinctive features relating
to scratching. The sensitivity of AE signals to the CMP process state change was also investigated. The results show that
this AE sensing technology can be used as a tool for in-situ microscratch detection and process monitoring in CMP. |
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| Keywords: | Acoustic chemical mechanical planarization (CMP) emission microscratch sensor |
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