紫外激光在半导体芯片切割中优势的研究

介绍了紫外激光切割技术的优越性,综述了紫外激光切割技术在半导体芯片切割中的应用．指出了传统砂轮切割技术在半导体芯片切割工艺的局限性,对各自的工作原理、特点、作了重点阐述。对传统砂轮切割技术和紫外激光切割技术进行了实验比较,并对紫外激光切割技术在半导体芯片切割工艺上的发展前景作了展望。

Research on Advantages of UV Laser in Semiconductor Wafer Cutting

The unique wavelength and processing characteristics of ultraviolet （UV） laser, bring tremendous progress for wafer cutting process. In this paper, the advantage of UV laser cutting technology is discussed. The development and application of UV laser cutting for wafer cutting process are summarized. The limitation of traditironal microelectronic cutting methods for wafer cutting process is discussed. The principle, characteristics and advantages of several wafer cutting methods are introduced The traditironal microelectronic cutting methods and UV laser cutting methods are compared with each other in experiment.and the trend of UV laser cutting technology is viewed.