某电子设备通风口布局优化设计

以某电子设备的热结构设计为例,利用CFD技术探讨了系统级的强迫风冷散热问题.在内部结构一定的条件下,设计通风口和风扇的布局,以优化设备内部流场,从而提高设备的散热性能.通过比较两种不同风扇功率下设备的散热性能,讨论了风扇配置与设备散热效率之间的关系.结果表明,合理的通风口和风扇的布局可以显著地提高电子设备的散热性能.风扇数目的增加只有在对设备内部流场进行优化的条件下才能提高设备的散热性能.增大风扇功率可以提高电子设备的散热效果,但其散热效率并不一定理想.

The Layout Optimization Design for the Vents of Certain Electronic Equipment

Taking the thermal design of certain electronic equipment as an example, the convection air cooling of electronic equipment in the system level is discussed. Under the constraint of unchanging the inner structures of the equipment, the distribution of the inlet vent and fans is designed to optimize flow field, which can improve the heat dissipation capability of the equipment~ Two kinds of fans are compared. The relation be- tween fan capability and the heat dissipation efficiency of the equipment is investigated. The results suggest that the rational distribution of the inlet vent and fans can improve the heat dissipation of the electronic equip- ment significantly. The increase of numbers of the fans can improve the heat dissipation capability of the equipment only when the inner flow field is optimized. Meanwhile, increasing the fan power can improve the heat dissipation capability of the equipment, but its efficiency is not necessarily ideal.