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高性能导电薄膜的制备
引用本文:张树人,陈国良,郭太良.高性能导电薄膜的制备[J].真空,2007,44(3):24-27.
作者姓名:张树人  陈国良  郭太良
作者单位:福州大学物理与通信工程学院,福建,福州,350002
基金项目:国家高技术研究发展计划(863计划)平板显示重大专项项目
摘    要:采用磁控溅射法在玻璃基底上制备了Cr-Cu-Al-Cr薄膜,用焊接法测试薄膜附着性能,用x射线衍射仪(XRD)、原子力显微镜(AFM)和台阶仪对薄膜进行表征,研究溅射过程中以及在高温大气环境下薄膜的防氧化方法,分析薄膜晶粒大小与电性能关系,制备出性能较好的导电膜。

关 键 词:附着性  氧化  晶粒  电学性能
文章编号:1002-0322(2007)03-0024-04
修稿时间:2006-10-10

Preparation of high-performance conductive thin films
ZHANG Shu-ren,CHEN Guo-liang,GUO tai-liang.Preparation of high-performance conductive thin films[J].Vacuum,2007,44(3):24-27.
Authors:ZHANG Shu-ren  CHEN Guo-liang  GUO tai-liang
Affiliation:Physics and Information Engineering College of Fuzhou University, Fuzhou 350002, China
Abstract:Cr-Cu-Al-Cr thin films were deposited on glass substrates by magnetron sputtering.The adhesion of the films was tested by welding method.The films were characterized by x-ray diffraction(XRD),atomic force microscopy(AFM)and surface profilometer to investigate the preparation of the thin film by way of improving the oxidation resistance in the magnetron sputtering process and high-temperature atmosphere in addition to discussing the relation between grain size and electrical properties.
Keywords:adhesion  oxidation  grain  electrical properties
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