| 低温共烧陶瓷(LTCC)工艺的研究 |
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| 引用本文： | 吕琴红,李俊. 低温共烧陶瓷(LTCC)工艺的研究[J]. 电子工业专用设备, 2009, 38(10): 22-25 |
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| 作者姓名： | 吕琴红 李俊 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西,太原,030024;中国电子科技集团公司第二研究所,山西,太原,030024 |
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| 摘 要： | 低温共烧陶瓷（LTCC）技术是近年发展起来的令人瞩目的整合组件技术，已经成为无源集成的主流技术，成为无源元件领域的发展方向和新的元件产业的经济增长点。叙述了低温共烧陶瓷技术（LTCC）的制备工艺以及未来应用前景。
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| 关 键 词： | 低温共烧陶瓷 LTCC工艺 基板 |
The Research of Low Temperature Co-fired Ceramic(LTCC) Technology Manufacturing Process |
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| LV Qinhong,LI Jun. The Research of Low Temperature Co-fired Ceramic(LTCC) Technology Manufacturing Process[J]. Equipment for Electronic Products Marufacturing, 2009, 38(10): 22-25 |
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| Authors: | LV Qinhong LI Jun |
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| Affiliation: | LV Qinhong,LI Jun (The 45th Insitute of CETC,Beijing East Yanjiao 065201 China) |
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| Abstract: | The low temperature co-fired ceramic (LTCC) technology has already become an integrated technology of electric components. As a new integrating and packing technology, it have successfully applied to the integrating technology of the passive component for its excellent high frequency high Q and high speed transfer characteristics. The manufacturing process of the LTCC and its extensive application prospect are introduced particularly. |
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| Keywords: | Low Temperature Co-fired Ceramic LTCC process Base plate |
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