| 低温共烧陶瓷射频无源集成基础技术研究进展 |
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| 引用本文： | 燕文琴,刘颖力,张怀武.低温共烧陶瓷射频无源集成基础技术研究进展[J].磁性材料及器件,2006,37(5):11-14. |
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| 作者姓名： | 燕文琴 刘颖力 张怀武 |
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| 作者单位： | 电子科技大学,微电子与固体电子学院,四川,成都,610054 |
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| 基金项目： | Advance in Research on Fundamental Technology of LTCC RF Passive Integration |
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| 摘 要： | 低温共烧陶瓷(LTCC)技术是当今世界射频无源集成的关键技术,嵌入式无源元件设计与模型化是LTCC重要基础技术。本文介绍了LTCC射频无源集成的关键技术,并着重介绍了射频无源元件(如电感、电容)的等效电路模型的发展过程。
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| 关 键 词： | 低温共烧陶瓷(LTCC) 射频无源集成 嵌入式无源元件 等效电路模型 |
| 文章编号： | 1001-3830(2006)0011-04 |
| 收稿时间： | 2005-12-12 |
| 修稿时间： | 2006-04-28 |
Advance in Research on Fundamental Technology of LTCC RF Passive Integration |
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| YAN Wen-qin,LIU Ying-li,ZHANG Huai-wu.Advance in Research on Fundamental Technology of LTCC RF Passive Integration[J].Journal of Magnetic Materials and Devices,2006,37(5):11-14. |
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| Authors: | YAN Wen-qin LIU Ying-li ZHANG Huai-wu |
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| Affiliation: | Institute of Microelectronics and Solid Electronics, University Electronic Science and Technology, Chengdu 610054, China |
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| Abstract: | The low temperature co-fired ceramics (LTCC) technology is the key technology of RF passiveintegration in modern world, the design and modeling of embedded devices is important fundamental technology. Herewe introduce the key technology of RF passive integration, especially the development course of equivalent circuitmodel of RF passive devices. |
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| Keywords: | low temperature co-fired ceramics (LTCC) RF passive integration embedded passive devices equivalent circuit model |
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