Study of siloxane-modified epoxy resin using thermally stimulated current(II) |
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| Authors: | S -M Shin D -K Shin D -C Lee |
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| Affiliation: | (1) Material Testing Laboratory, Korea Research Institute of Chemical Technology, P.O. Box 107, Yusong, Taejon 305-600, Korea, KR;(2) Department of Polymer Science & Engineering, Inha University, Inchon, Korea, KR |
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| Abstract: | Thermally stimulated current (TSC) and relaxation map analysis (RMA) was used to characterize the low temperature relaxation
of epoxy resin modified with siloxane oligomers. In aminopropyl-terminated siloxane oligomer (ATSO) the β-relaxation of epoxy resin and the glass transition temperature of siloxane oligomer were folded regardless of the concentration
of diphenyl. The β-relaxation of epoxy resin and the glass transition temperature of oxiranylmethoxy-terminated siloxane oligomer (OTSO) were
folded and shifted to higher temperature as the concentration of diphenyl in siloxane oligomer increased. In the systems containing
of diphenyl in siloxane oligomer a new relaxation peak due to the space charge was observed in the range of − 80 °C to − 50 °C
and − 30 °C to 5 °C. As the concentration of diphenyl increased the compensation temperature (Tc) and the degree-of-disorder (DOD) were increased while the compensation time, τ
c was decreased.
Received: 26 May 1997/Accepted: 27 June 1997 |
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