锡-铅镀层铅凝结是否产生晶须的探讨 |
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引用本文: | 周瑞山.锡-铅镀层铅凝结是否产生晶须的探讨[J].涂装与电镀,2010(3):37-38,30. |
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作者姓名: | 周瑞山 |
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作者单位: | 中国振华集团云科电子有限公司,贵州贵阳550018 |
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摘 要: | 本文通过锡-铅镀层铅凝结现象,查找有关电镀理论,收集国内外锡-铅镀层电镜扫描图分析,探讨锡-铅镀层铅凝结是否产生晶须问题。
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关 键 词: | 锡-铅 铅凝结 晶须 |
Discussion about Whether or Not Produce Whisker for Lead's Coagulation of Sn - Pb Plating |
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Abstract: | This paper discussed the problem about whether or not probuce whisker for lead' s coagulation of Sn-Pb plating on the basis of gather data of electroplating theory and analysis electron microscope scanning graph of Sn - Pb plating at home and abroad. |
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Keywords: | Sn-Pb lead' s coagulation whisker |
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