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CO2激光直写结合湿法刻蚀加工玻璃基微流控芯片
引用本文:刘晓清,郝苇苇,高巍巍,周勇亮. CO2激光直写结合湿法刻蚀加工玻璃基微流控芯片[J]. 传感技术学报, 2006, 19(5): 2038-2040
作者姓名:刘晓清  郝苇苇  高巍巍  周勇亮
作者单位:厦门大学化学化工学院化学系,化学生物学福建省重点实验室,福建,厦门,361005
基金项目:福建省科技厅科研项目,教育部留学回国人员科研启动基金
摘    要:玻璃是制作微流控芯片的重要材料,其加工工艺主要基于光刻后湿法腐蚀,对设备和实验室要求较高.本文提出以普通指甲油和指甲油/金/铬为牺牲层,利用CO2激光烧蚀开窗口,辅以湿法腐蚀加工玻璃基微流控芯片的方法,并考察了激光加工参数,腐蚀液组成,牺牲层等因素对芯片质量的影响.该方法简便易行,不需要光刻的昂贵设备和繁杂步骤.

关 键 词:微流控芯片  制作  CO2激光  湿法腐蚀
文章编号:1004-1699(2006)05-2038-03
修稿时间:2006-07-01

Fabrication of glass microfluidic chip by laser direct writing and wet etching
Liu Xiaoqing,Hao Weiwei,Gao Weiwei,Zhou Yong-liang. Fabrication of glass microfluidic chip by laser direct writing and wet etching[J]. Journal of Transduction Technology, 2006, 19(5): 2038-2040
Authors:Liu Xiaoqing  Hao Weiwei  Gao Weiwei  Zhou Yong-liang
Affiliation:Department of Chemistry and The Key Laboratory for Chemical Biology of Fujian Province, College of Chemistry and Chemical Engineering, Xiamen University,Xiamen361005
Abstract:Glass chips fabricated by photolithography and wet etching was popularly used in the microfluidic field. A method was developed to fast fabricate glass chip avoid photolithography. The enamel and enamel/Au/Cr film were used as sacrificial layer, then the development of pattern carried out by CO_2 laser before wet etching. The effect of parameter of CO_2 laser, etching solution and sacrificial layer were evaluated.
Keywords:microfluidic chip  fabrication  CO_2 laser  wet etching
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