Coupled thermoelasticity analysis of FGM plate integrated with piezoelectric layers under thermal shock

Abstract

Based on theory of piezoelectricity and using generalized coupled thermoelasticity, transient response of a simply supported functionally graded material rectangular plate embedded in sensor and actuator piezoelectric layers under applied electric field and thermal shock is studied. Thermoelastic properties of the plate vary continuously along the thickness direction according to exponential functions and Poisson ratio is assumed to be constant. Applying Fourier series state space technique to the basic coupled thermoelastic differential equations results in the ordinary differential equations which are solved analytically by using Laplace transform. Validation of the present approach is assessed by comparing the numerical results with the available results in literature. In parametric study, effect of the relaxation time, applied voltage and temperature and time history of the thermoelastic response of FGM plate attached to piezoelectric layers are investigated.