THERMALLY INDUCED STRESSES IN A TRILAYERED SYSTEM

The objective of this investigation is to conduct a parametric study of thermally induced stresses in trilayered media. In particular, the resulting shear and normal stresses along the media interfaces is analyzed. Because this investigation is concerned only with the failure at the bonding surfaces, the results of bending stresses, although calculated, are not presented. A finite element model utilizing a recently developed element that provides for both axial and lateral displacement continuity is employed. First, the effect of the material property, that is, coefficient of thermal expansion, is examined. Then the effect of geometric configuration, that is, the length and thickness dimensions of the midlayer, is analyzed. Finally, a study of the effect of a nonuniform temperature field on the trimaterial medium is conducted.