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基于自隔离技术的可集成SOI高压功率器件新结构
引用本文:高唤梅,罗小蓉,张伟,邓浩,雷天飞. 基于自隔离技术的可集成SOI高压功率器件新结构[J]. 半导体学报, 2010, 31(8): 084012-6
作者姓名:高唤梅  罗小蓉  张伟  邓浩  雷天飞
基金项目:This work is supported by the projects of NO. JPPT-115-2-1059, the National Natural Science Foundation of China (NO. 60806025 and NO. 60976060).
摘    要:SOI功率器件的高耐压和高、低压间良好的隔离效果是SOI高压功率集成电路(SOI HVIC)的两项关键技术。本文提出在埋氧层(buried oxide layer,BOX)上表面处埋N岛 (buried n-islands,BNI) 的SOI LDMOS高压功率器件新结构,该结构采用自隔离技术使SOI HPIC中高压功率器件与低压控制电路单元之间达到理想的隔离效果。此外,N岛中的施主离子和位于耗尽N岛间的空穴使BOX层的电场强度从32V/μm增加到113V/μm,同时对漂移区表面电场分布进行调制,最终使器件击穿电压(BV)显著提高。实验测得一个BNI SOI LDMOS样品的耐压为673V,并在SOI HVPIC中表现出良好的隔离特性。

关 键 词:高压集成电路  功率器件  SOI  隔离技术  LDMOS器件  基础  电场分布  HVIC
修稿时间:2010-03-29

A new integrated SOI power device based on self-isolation technology
Gao Huanmei,Luo Xiaorong,Zhang Wei,Deng Hao and Lei Tianfei. A new integrated SOI power device based on self-isolation technology[J]. Chinese Journal of Semiconductors, 2010, 31(8): 084012-6
Authors:Gao Huanmei  Luo Xiaorong  Zhang Wei  Deng Hao  Lei Tianfei
Affiliation:State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China;State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China;State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China;State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China;State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
Abstract:
Keywords:buried n-islands  self-isolation  breakdown voltage  electric field  SOI oindent
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