太阳能硅片切割技术的研究

简述了太阳能硅片常用的切割方法及特点,指出电火花线切割由于其适合大厚度、超薄切割等特点,将成为太阳能硅片切割的一个研究热点.但因半导体特殊的电特性,目前常规电火花线切割工艺还不能胜任太阳能硅的切割.研究了太阳能硅材料的放电加工模型,提出了电火花线切割太阳能硅片的思路和工艺方法,并采用改进的脉冲电源首次对电阻率为2.1 Ω*cm的P型太阳能硅进行了切割试验,切割效率大于100 mm2/min.

The Research of Slicing Technique for Solar Silicon Ingot

This paper discusses the characteristic and common methods of slicing solar silicon wafer,pointing out it will be a hotspot of researching solar silicon wafer sliced by WEDM with characteristics of large and ultra-thin thickness,because of no macro cutting force and suitable for cutting high thickness in machining.However,conventional method of slicing with WEDM can't satisfy the requirement of slicing solar silicon with special electric characteristic of semi-conductor,so after researching the discharge ma...