| 塑封IC失效分析及对策 |
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| 引用本文： | 王立国,邵刚.塑封IC失效分析及对策[J].电子工业专用设备,2012,41(1):27-32. |
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| 作者姓名： | 王立国 邵刚 |
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| 作者单位： | 天水华天科技股份有限公司,甘肃天水,741000 |
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| 摘 要： | 阐述了塑封IC(集成电路)常见的失效现象,对塑封IC失效的几种分析方法和分析技术做了叙述,然后提出塑封IC失效分析的步骤,并从设计、工艺和材料控制、包装、运输等方面提出改善塑封IC可靠性的措施。
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| 关 键 词： | 塑封IC 失效分析 改善措施 |
Failure Analysis and Countermeasures for Plastic IC |
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| WANG Liguo,SHAO Gang.Failure Analysis and Countermeasures for Plastic IC[J].Equipment for Electronic Products Marufacturing,2012,41(1):27-32. |
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| Authors: | WANG Liguo SHAO Gang |
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| Affiliation: | (Tianshui Huatian Technology Co.,Ltd,Tianshui 741000,China) |
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| Abstract: | Described the failure of plastic IC common phenomenon in detail several of Plastic IC failure analysis methods and analysis techniques do narrative,and then put forward the steps Plastic IC failure analysis and design,process and material control,transportation and other aspects of the box measures to improve the reliability of plastic IC. |
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| Keywords: | Plastic IC Failure analysis Improvement measures |
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