High-temperature compressive creep of liquid phase sintered silicon carbide |
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| Affiliation: | 1. Department of Engineering Mechanics, School of Naval Architecture, Ocean and Civil Engineering (State Key Laboratory of Ocean Engineering, Collaborative Innovation Center for Advanced Ship and Deep-Sea Exploration), Shanghai Jiao Tong University, Shanghai 200240, China;2. School of Engineering, Brown University, Providence 02912, USA;1. São Paulo State University (Unesp), Institute of Chemistry, Araraquara, São Paulo 14800-060, Brazil;2. Federal University of São Carlos (UFSCar), Department of Chemistry, São Carlos, São Paulo 13565-905, Brazil;1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;2. Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G6;1. School of Mechanical Engineering, Southeast University, Nanjing, 211189, PR China;2. Ministry of Education Key Laboratory of Structure and Thermal Protection for High-Speed Aircraft, Southeast University, Nanjing, 211189, PR China;3. Jiangsu Engineering Research Center of Aerospace Machinery, Southeast University, Nanjing, 211189, PR China;4. Science and Technology on Space Physics Laboratory, China Academy of Launch Vehicle Technology, Beijing, 100076, PR China;1. Institute of Tools Surface Engineering, School of Mechanical Engineering, Taizhou University, Taizhou 318000, PR China;2. State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, PR China |
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| Abstract: | Creep of liquid phase sintered SiC has been studied at temperatures between 1575 and 1700°C in argon under nominal stresses from 90 to 500 MPa. Creep rates ranged from 3×10−8 to 10−6/s, with an activation energy of 840±100 kJ/mol (corresponding to carbon and silicon self-diffusion), and a stress exponent of 1.6±0.2. The crept samples showed the presence of dislocation activity, generally forming glide bands and tangles. Degradation of the mechanical properties due to cavitation or reaction of the additives was not detected. SEM and TEM microstructural characterization and analysis of the creep parameters leads to the conclusion that the creep mechanisms operating are grain boundary sliding accommodated by lattice diffusion and climb-controlled dislocation glide operating in parallel. Other possible operating mechanisms are discussed and the data are compared with published data. |
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