623K温度下SnxZn1-x/Ni扩散偶的界面反应

为研究Sn-Zn合金(无铅焊料的候选者)和Ni基体(Cu基上的扩散阻挡层)的界面反应,制备一系列原子分数x分别为14.8％、22％和31％的液固扩散偶Sn1-xZnx/Ni；在623 K温度下恒温退火后,用扫描电镜和电子探针检测与分析扩散偶的界面结构,研究退火时间和合金中的Zn含量对扩散层结构和形貌的影响.结果表明,S...

Investigation of interfacial reaction of SnxZn1-x/Ni diffusion couples at 623 K

Interfacial reaction of Sn-Zn alloys(one of the attractive Pb-free solders) and Ni(one of diffusion barrier deposited on Cu) substrate was investigated using Sn1-xZnx/Ni(with atomic fraction of x=14.8%,22% and 31%,respectively);and after the liquid-solid diffusion couples annealing at 623 K for various time of durations,interfacial microstructure was analyzed by scanning electron microscopy and electron probe micro-analysis.It is found that when Sn1-xZnx/Ni liquid-solid diffusion couples annealed at 623 K for 4 h,γ-Ni5Zn21 appeares at interface;and when Sn1-xZnx/Ni diffusion couples annealed at 632 K for 24 h,Ni4Zn2Sn4 and γ-Ni5Zn21 appeares at interface between liquid and Ni substrate.Besides,the phase formation sequence and diffusion zone morphology are illustrated with diffusion theory,three-phase equilibrium of γ-Ni5Zn21+Ni4Zn2Sn4+L has been determined.The Zn content in the Sn-Zn alloy will affect the morphology and structure of the diffusion layers.