| 利用混合电位理论研究化学镀Ni-Cu-P镀液的稳定剂 |
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| 引用本文： | 马梅荣,邓舒太,王桂香,李宁. 利用混合电位理论研究化学镀Ni-Cu-P镀液的稳定剂[J]. 电镀与环保, 2006, 26(4): 26-28 |
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| 作者姓名： | 马梅荣 邓舒太 王桂香 李宁 |
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| 作者单位： | 哈尔滨工业大学(威海)海洋学院,山东,威海,264209;深圳比亚迪,广东,深圳,518119 |
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| 摘 要： | 通过试验优选了ABS塑料上化学镀Ni-Cu-P镀液的稳定剂a、c,并研究了其效果.稳定剂提高了镀液的稳定性,通过混合电位-时间曲线的研究和其对镀液稳定时间和镀速的影响,确定了稳定剂的加入量.
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| 关 键 词： | ABS塑料 化学镀 稳定剂 |
| 文章编号： | 1000-4742（2006）04-0026-03 |
| 收稿时间： | 2005-11-25 |
| 修稿时间： | 2005-11-25 |
A Study of Stabilizers for Electroless Ni-Cu-P Alloy Plating by Mixed Potential Theory |
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| MA Mei-rong,DENG Shu-tai,WANG Gui-xiang,LI Ning. A Study of Stabilizers for Electroless Ni-Cu-P Alloy Plating by Mixed Potential Theory[J]. Electroplating & Pollution Control, 2006, 26(4): 26-28 |
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| Authors: | MA Mei-rong DENG Shu-tai WANG Gui-xiang LI Ning |
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| Affiliation: | 1.Ocean College, Harbin Institute of Technology (Weihai;Shenzhen |
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| Abstract: | Stabilizer a and c for electroless Ni-Cu-P plating on ABS plastics are selected on an optimum basis through experiments and their effects are also investigated.The stabilizers can improve the stability of the bath.The dose of the stabilizers is determined by studying the mixed potential-time curves and the impact of stabilizing time on the plating rate. |
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| Keywords: | ABS plastics electroless plating stabilizer |
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