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AlN陶瓷的飞秒激光表面加工及制孔应用
引用本文:王海龙,李铁,王宏建.AlN陶瓷的飞秒激光表面加工及制孔应用[J].半导体光电,2021,42(5):668-671.
作者姓名:王海龙  李铁  王宏建
作者单位:松山湖材料实验室,广东东莞523808
基金项目:广东省基础与应用基础研究基金项目(2020A1515111183).*通信作者:王宏建
摘    要:采用飞秒激光对AlN陶瓷进行表面加工实验,分析了激光能量密度和扫描速度对加工表面形貌和尺寸的影响,优选出兼顾加工质量与效率的工艺参数区间,即能量密度10~14 J/cm2,扫描速度20~30 mm/s.基于此,以螺旋扫描轨迹于AlN陶瓷上进行制孔应用,成功实现了无崩边及微裂纹等缺陷的圆孔、方孔及跑道孔加工.该研究验证了飞秒激光加工高质量多孔型的可行性,推动了硬脆材料激光制孔技术在半导体功率器件领域的应用.

关 键 词:AlN  飞秒激光  表面加工  制孔
收稿时间:2021/6/30 0:00:00

Femtosecond Laser Surface Processing of AlN Ceramic and Drilling Application
WANG Hailong,LI Tie,WANG Hongjian.Femtosecond Laser Surface Processing of AlN Ceramic and Drilling Application[J].Semiconductor Optoelectronics,2021,42(5):668-671.
Authors:WANG Hailong  LI Tie  WANG Hongjian
Affiliation:Songshan Lake Materials Laboratory, Dongguan 523808, CHN
Abstract:The experiments of surface processing were performed on AlN ceramic by femtosecond laser, and the effects of laser energy density and scanning speed on the surface morphology and size were analyzed. Considering the processing quality and efficiency, the optimized parameters of energy density of 10~14J/cm2 and scanning speed of 20~30mm/s were selected. Based on this, the spiral scanning track was applied to drill holes on AlN ceramic. The round, square and runway holes without micro-crack and edge chipping were successfully realized. This study verifies the possibility of femtosecond laser processing high-quality holes with multi-shapes. It promotes the application of laser drilling technology for hard and brittle materials in the field of semiconductor power devices.
Keywords:AlN  femtosecond laser  surface processing  drilling
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