| 芯片面积对CSOP10型陶瓷封装IC热特性的影响研究 |
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| 引用本文： | 张峪铭,易文双,夏军,王雅婷,付晓君.芯片面积对CSOP10型陶瓷封装IC热特性的影响研究[J].微电子学,2021,51(5):761-765. |
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| 作者姓名： | 张峪铭 易文双 夏军 王雅婷 付晓君 |
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| 作者单位： | 中国电子科技集团公司 第二十四研究所, 重庆 400060;模拟集成电路国家级重点实验室, 重庆 400060 |
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| 摘 要： | 针对CSOP10型陶瓷封装集成电路热特性参数随芯片面积的变化规律,运用仿真分析、理论计算、试验相结合的方法展开研究。结果表明,仿真分析与理论计算、试验的误差在合理范围内；随着芯片面积增大,CSOP10型陶瓷封装集成电路的结-壳热阻、结-环境热阻、结-壳热特性三种热特性参数随之减小,变化趋势减缓,数值趋于稳定。
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| 关 键 词： | 集成电路 陶瓷封装 CSOP 热特性 芯片面积 |
| 收稿时间： | 2020/12/23 0:00:00 |
Study on the Influence of Die Size on Thermal Characterization of CSOP10 Ceramic Package IC |
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| ZHANG Yuming,YI Wenshuang,XIA Jun,WANG Yating,FU Xiaojun.Study on the Influence of Die Size on Thermal Characterization of CSOP10 Ceramic Package IC[J].Microelectronics,2021,51(5):761-765. |
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| Authors: | ZHANG Yuming YI Wenshuang XIA Jun WANG Yating FU Xiaojun |
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| Affiliation: | The 24th Research Institute of China Electronics Technology Group Corp., Chongqing 400060, P.R.China; National laboratory of Science and Technology on Analog Intergrated circuit, Chongqing 400060, P.R.China |
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| Abstract: | To investigate the evolution law of the thermal characterization of CSOP10 ceramic package IC with the die size, a series of researches based on simulation analysis, theoretical calculation and experiment were developed. The contrastive study results showed that the errors of the combined methods were within reasonable ranges. The thermal characterization including the junction-to-case thermal resistance, the junction-to-ambient thermal resistance and the junction-to-case thermal characterization decreased with the increase of the die size. The trends of these changes slowed down, and the values tended to be stable. |
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| Keywords: | IC ceramic package CSOP thermal characterization die size |
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