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Skin effect of on-chip copper interconnects on electromigration |
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| Authors: | W. Wu J. S. Yuan |
| Affiliation: | Chip Design and Reliability Laboratory, School of Electrical Engineering and Computer Science, College of Engineering, University of Central Florida, Orlando, FL 32816, USA |
| Abstract: | A simple model is derived to evaluate skin effect of on-chip copper interconnects on electromigration. The result gives the range of frequency in which skin effect on electromigration need to be taken into consideration. |
| Keywords: | Skin effect Copper interconnect Electromigration Reduced vacancy concentration Mean time to failure |
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