Effect of pulse parameter on preparation of W coating on V alloy |
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| Affiliation: | 1. Department of Nuclear Engineering, Seoul National University, Seoul, Republic of Korea;2. Max-Planck-Institut fuer Plasmaphysik, EURATOM Association, Garching bei München, Germany;3. Department of Applied Physics and Applied Mathematics, Columbia University, New York, USA;4. National Fusion Research Institute, Daejeon, Republic of Korea;1. ITER Project Unit, Japan Atomic Energy Agency (JAEA), Naka, 311-0193 Ibaraki, Japan;2. ITER Organization, Route de Vinon sur Verdon, 13115 Saint Paul Lez Durance, France;1. University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands;2. Institute of Plasma Physics, Chinese Academy of Science (ASIPP), Hefei 230031, People''s Republic of China;3. ITER Organisation, route de Vinon sur Verdon, 13115 Saint Paul lez Durance, France;1. Electrical and Computer Engineering Department, University of Houston, Houston, TX 77204-4005, USA;2. Materials Science and Engineering Graduate Program, School for Engineering of Matter, Transport and Energy and LeRoy Eyring Center for Solid State Science, Arizona State University, AZ 85287-1704, USA;3. Chemical and Biomolecular Engineering Department, University of Houston, Houston TX 77204-4004, USA |
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| Abstract: | The tungsten coatings were prepared on vanadium alloy substrate by pulse electroplating in Na2WO4–WO3 molten salt. A series of tungsten coatings with compact and smooth morphologies were successfully obtained under various conditions. Orthogonal experimental design method was used to analysis the influence degree of current density, duty cycle and period on tungsten grain size, coatings thickness and current efficiency. The results demonstrated that current density was the most important factor influencing tungsten grain size and tungsten coatings thickness, which all had a positive correlation with current density. The pulse duty was the most important factor influencing current efficiency; the result also showed a positive correlation between current efficiency and pulse duty factor. |
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| Keywords: | Tungsten coating Pulse current parameters Electroplating Orthogonal experiment |
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