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Nano materials for microelectronic and photonic packaging |
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| Authors: | Ching-Ping WONG Wei LIN Ling-Bo ZHU Hong-Jin JIANG Rong-Wei ZHANG Yi LI Kyoung-Sik MOON |
| Affiliation: | School of Materials Science and Engineering, Microsystems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA |
| Abstract: | This paper addresses the state-of-the-art nano-science and technology regarding next generation high density microelectronics and photonics packaging applica-tions, including carbon nanotubes (CNTs) for electrical/thermal devices, and molecular wires for electrical interconnects, etc. |
| Keywords: | carbon nanotube molecular wire electrical interconnect thermal management |
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