Ti_2AlN-La_2O_3/Cu复合材料的界面反应与性能

采用粉末冶金法制备了以Ti2AlN和La2O3为增强相的新型铜基复合材料。研究了Ti2AlN与Cu界面反应及其对复合材料性能的影响。结果表明:Ti2AlN颗粒化学镀铜后改善了铜与Ti2AlN的界面结合情况,形成了宽度为20 nm左右的过渡区。在880~940℃的烧结温度范围内,增强相与基体的界面发生化学反应,生成了Cu(Al)固溶体与TiNx,在显著提高复合材料强度的同时,降低材料的导电性。另外,La2O3纳米颗粒分布在铜基体内,对材料起到弥散强化的作用。

Interfacial Reaction and Properties of Ti2AlN-La2O3/Cu Composite

A novel Cu based composite was fabricated by powder metallurgy, which was reinforced by Ti2AlN and La2O3. The study was focused on the Ti2AlN-Cu interfacial reaction and its effect on the properties of Ti2AlN-La2O3/Cu composite. The results indicate that Ti2AlN particles with a copper coating is effective for interfacial bonding, and a transition zone of 20 nm width forms between Ti2AlN and Cu matrix. In the range of sintering temperature from 880 oC to 940 oC, a reaction happens between Ti2AlN and plated copper layer. New substances, Cu(Al) and TiNx form, which is beneficial to the increasing of tensile strength, but harmful to electrical conductivity. In addition, La2O3 nanoparticles disperse in the Cu matrix which also strengthens the composite.