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Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer |
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| Authors: | Deng Yongqiang Sheng Guangmin and Yin Lijing |
| Affiliation: | Chongqing University, Chongqing 400044, China |
| Abstract: | |
| Keywords: | titanium stainless steel impulse pressuring diffusion bonding Cu interlayer mechanical properties |
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