芯片制造的电化学处理技术

电化学处理技术的性价比优势在芯片制造上是一个范例转移。Cu芯片金属化的双大马士革处理和面阵列芯片封装互连的C4(倒装)技术使电化学技术置于最复杂的制造工艺技术之间。这些工艺技术被集成到用于芯片制造的300mm晶圆处理中。新材料和工艺的持续发展来满足微处理器件不断增加性能和小型化的趋势。电迁移问题和集成超低k电介质材料与Cu镀层的新抛光方法是芯片制造中的一个关键问题。发展一个适用成本低的无铅C4芯片封装互连是微电子工业的主要目标,微电子工业正作努力在几年里市场化无铅产品。

Electrochemical Processing Technologies in Chip Fabrication: Challenges and Opportunities

The superiority of effectiveness for electrochemical processing technologies in chip chip fabrication is a example shift .Copper Dual Damascene processing for chip metallization, and C4(Flip-chip) technologies of planar array chip packaging interconnection cause the electrochemical technologies place in the most complication processing for chip fabrication processing. Now the process technologies is integrated in 300mm wafer processing for chip fabrication. The continue development of new materials and technologies is meeting the trend of uninterrupted increasing performance and miniaturize of microprocessor industry. A key problem in chip fabrication is that the new polish method for electromigration and ultra-low K dielectric and Cu electroplating level. It is a major goal to develop a suit and cost effective lead-free C4 chip packaging interconnection is microelectronics .Now the microelectronics industries are making great efforts to market lead-free products in few years.