The wetting transition in high and low energy grain boundaries in the Cu(In) system |
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| Affiliation: | 1. Department of Materials Physics, Montanuniversität Leoben, Franz Josef-Straße 18, 8700 Leoben, Austria;2. Infineon Technologies Austria AG, Siemensstraße 2, 9500 Villach, Austria;3. KAI Kompetenzzentrum Automobil- u. Industrieelektronik GmbH, Europastraße 8, 9524 Villach, Austria;4. Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria;1. Instituto Balseiro, Bustillo 9500, S. C. de Bariloche, Argentina;2. Centro Atómico Bariloche, Comisión Nacional de Energía Atómica, Av. Bustillo 9500, 8400 San Carlos de Bariloche, Argentina;3. Department of Materials Science & Engineering, Saarland University, D-66123 Saarbruecken, Germany |
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| Abstract: | Wetting of two symmetrical tilt grain boundaries, 77° 〈110〉 and 141° 〈110〉, in synthetic copper bicrystals with a Cu(In) melt was studied in the temperature range 690°990°C. The contact angle at the site of GB intersection with the solid-melt interface was measured. A wetting transition occurred at Tw = 960 ± 6°C for the 77° 〈110〉 grain boundary and at Tw = 930 ± 5°C for the 141° 〈110〉 grain boundary. The contact angle approached zero for this transition. The relative surface energies of the two boundaries were measured using the thermal grooving technique. The energy of the 77° 〈110〉 grain boundary is about 40% lower than that of the 141° 〈110〉 grain boundary. Therefore, it has been shown experimentally that the lower the grain boundary energy, the higher the wetting transition temperature. This is in agreement with the thermodynamic model of wetting transitions on grain boundaries. |
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