| 基于概率排序的Chip类元件焊点检测方法 |
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| 引用本文： | 吴福培,李昇平,张宪民.基于概率排序的Chip类元件焊点检测方法[J].焊接学报,2014,35(6):39-43. |
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| 作者姓名： | 吴福培 李昇平 张宪民 |
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| 作者单位： | 汕头大学机械电子工程系;华南理工大学机械与汽车工程学院; |
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| 基金项目： | 国家高技术研究发展计划项目(863计划,2012AA050302);国家自然科学基金资助项目(51305247、51175314);广东省自然科学基金资助项目(S2013010015788);广东省高校优秀青年创新人才培养计划(2012LYM_0062);广东省科技计划项目(2012B011300044) |
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| 摘 要： | 为了提高自动光学检测系统在焊点分类、检测准确性和检测速度等方面的性能,针对Chip类元件焊点提出了基于概率排序的检测方法.通过分析彩色焊点图像、建立各焊点类型的模型、定义检测区域、提取区域的面积、重心和色彩梯度特征,并以出现概率的高低规划各焊点类型的检测顺序,进而设计出Chip类元件的焊点检测算法.结果表明,所提方法能有效地检测Chip类元件8种常见的焊点类型,且检测速度获得了明显提高.详细的分类和准确的检测有利于SMT生产线的质量控制,而快速可靠的焊点检测利于提高生产线的效率.
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| 关 键 词： | 自动光学检测 焊点检测 晶片 色彩梯度 |
| 收稿时间： | 2013/11/28 0:00:00 |
Probability-sorting based inspection method for chip type solder joints |
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| WU Kupei,LI Shengping and ZHANG Xian-min.Probability-sorting based inspection method for chip type solder joints[J].Transactions of The China Welding Institution,2014,35(6):39-43. |
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| Authors: | WU Kupei LI Shengping and ZHANG Xian-min |
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| Affiliation: | Department of Mechatronic Engineering, Shantou University, Shantou 515063, China,Department of Mechatronic Engineering, Shantou University, Shantou 515063, China and School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China |
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| Abstract: | A probability-sorting based inspection method was proposed for chip type solder joints to improve the performance of automatic optical inspection on classification of solder joint, inspection accuracy and inspection speed. The algorithm of solder joint inspection was designed by analyzing the colorful images of solder joints, establishing model for each solder joint, defining inspection zone, extracting area of region, center of gravity and color gradient characters, and planning the inspection sequence. The experimental results illustrate that the proposed method could effectively detect and classify eight common types of chip solder joints with high inspection rate, which is useful for quality control in manufacturing process. And the inspection speed was obviously faster than other methods, which was lielplul to improve the efficiency of manufacturing process. |
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| Keywords: | automatic optical inspection solder joint inspection chip color grads |
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