| 时效处理对Sn-Zn-Ga-Nd钎焊接头界面及力学性能的影响 |
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| 引用本文： | 薛鹏, 薛松柏, 沈以赴. 时效处理对Sn-Zn-Ga-Nd钎焊接头界面及力学性能的影响[J]. 焊接学报, 2014, 35(1): 29-32. |
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| 作者姓名： | 薛鹏 薛松柏 沈以赴 |
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| 作者单位： | 南京航空航天大学材料科学与技术学院; |
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| 基金项目： | 江苏省普通高校研究生科研创新计划资助项目(CXZZ12_0148) |
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| 摘 要： | 研究了150℃时效条件下,不同时效时间对Sn-Zn-Ga-Nd钎焊接头界面组织及力学性能的影响.结果表明,Ga元素的添加有效抑制了钎焊接头界面附近稀土相的形成,即使经过长时间的时效处理后,界面附近仍然没有稀土相出现.在时效过程中,钎焊接头的剪切力随时效时间增加而降低,但下降幅度小于Sn-Zn-Nd及Sn-Zn钎焊接头.经过720 h的时效处理后,Sn-Zn-Ga-0.08 Nd接头的剪切力仍高于未经时效的Sn-Zn钎焊接头.
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| 关 键 词： | 时效处理 钎焊接头 界面 剪切性能 |
| 收稿时间： | 2013-10-09 |
Effect of aging treatment on interfacial microstructure and mechanical properties of Sn-Zn-Ga-Nd soldered joints |
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| XUE Peng, XUE Songbai, SHEN Yifu. Effect of aging treatment on interfacial microstructure and mechanical properties of Sn-Zn-Ga-Nd soldered joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(1): 29-32. |
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| Authors: | XUE Peng XUE Songbai SHEN Yifu |
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| Abstract: | The effect of aging treatment at 150℃ for different time on the interfacial microstructure and mechanical properties of Sn-Zn-Ga-Nd soldered joints was investigated. The results show that Ga could suppress the formation of Sn-Nd compound during the aging process and improve the reliability of soldered joints. The mechanical properties of the soldered joints further increased with the addition of Ga and Nd. The shear strength of soldered joints with Sn-Zn-Ga-0.08Nd decreased with increasing aging time,but was still remarkably higher than that of as-soldered joint with Sn-Zn solder. |
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| Keywords: | aging treatment soldered joint interface shear strength |
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