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集成电路的互连线延迟分析
引用本文:朱冬平,黄河,邝嘉.集成电路的互连线延迟分析[J].现代计算机,2008(3):18-22.
作者姓名:朱冬平  黄河  邝嘉
作者单位:华南师范大学计算机科学学院,广州510631
摘    要:IC制造技术先后进入亚微米、VDSM和LIDSM工艺,互连线延迟关注随之逐渐增强.事实上,互连线延迟早已超过了器件延迟,使IC设计重点转移到以互连线设计为核心.在对互连延迟模型、延迟影响因素、互连线延迟优化以及互连线延迟对IC设计的影响作简要分析基础上,给出了有价值的总结.

关 键 词:互连线  延迟  三维IC  寄生参数
修稿时间:2007年11月1日

Analysis of IC Interconnect Delay
ZHU Dong-ping,HUANG He,KUANG Jia.Analysis of IC Interconnect Delay[J].Modem Computer,2008(3):18-22.
Authors:ZHU Dong-ping  HUANG He  KUANG Jia
Affiliation:ZHU Dong-ping,HUANG He,KUANG Jia (Department of Computer,South China Normal University,Guangzhou 510631)
Abstract:IC manufacturing technology has entered the sub-micron, VDSM and UDSM processes, interconnect delay concern then has been gradually strengthened. In fact, the interconnect delay has been delayed more than a device, so IC design has shifted the focus of interconnect design at the core. On the basis of giving a brief analysis of the interconnection delay model, delayed impact of factors, optimization of interconnect as well as interconnect delay in the impact of IC design, Finally, concludes a valuable summar...
Keywords:UDSM
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