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Characterization of diffusion-bonded joint between Al and Mg using a Ni interlayer
Authors:Jian Zhang  Guo-Qiang Luo  Qiang Shen  Lian-Meng Zhang  Zhi-Jun Huang
Affiliation:1.Research and Development Center of Wuhan Iron and Steel (Group) Corporation,Wuhan,China;2.State Key Laboratory of Advanced for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan,China
Abstract:Aluminum and magnesium were joined through diffusion bonding using Ni interlayer. The microstructure and mechanical performance of the Al/Ni/Mg joints at different temperatures was investigated by means of scanning electron microscope (SEM), electro-probe microanalyzer (EPMA), X-ray diffraction (XRD), Vickers hardness testing, and shear testing. The results show that the addition of Ni interlayer eliminates the formation of Mg–Al intermetallic compounds and improves the bonding strength of the Al/Mg joints. The Al/Ni/Mg joints are formed by the diffusion of Al, Ni and Mg, Ni. The microstructure at the joint interface from Al side to Mg side is Al substrate/Al–Ni reaction layer/Ni interlayer/Mg–Ni reaction layer/Mg substrate multilayer structure. The microhardness of the Mg–Ni reaction layer has the largest value of HV 255.0 owing to the existence of Mg2Ni phase. With the increase of bonding temperature, the shear strength of the joints increases firstly and then decreases. The Al/Ni/Mg joint bonds at 713 K for 90 min, exhibiting the maximum shear strength of 20.5 MPa, which is greater than that of bonding joint bonded directly or with Ag interlayer. The fracture of the joints takes place at the Mg–Ni interface rather than the Al–Ni interface, and the fracture way of the joints is brittle fracture.
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