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高速PCB设计中GHz串行信号的完整性分析与仿真
引用本文:吕 平,杜晓宁,兰巨龙.高速PCB设计中GHz串行信号的完整性分析与仿真[J].信息工程大学学报,2006,7(4):364-367.
作者姓名:吕 平  杜晓宁  兰巨龙
作者单位:1. 信息工程大学,信息工程学院,河南,郑州,450002
2. 信息工程大学,政治部,河南,郑州,450002
基金项目:国家863计划资助项目(2003AA103510)
摘    要:文章针对信号频率超过GHz的高速串行信号带来的新的信号完整性问题,如:趋肤效应、介质损耗、码间串扰等进行了详细的分析;研究了这些信号完整性问题对于SI仿真的影响;给出解决GHz信号完整性问题的方案,并验证了方案的有效性。

关 键 词:串行器/解串器  信号完整性  损耗  预加重  眼图
文章编号:1671-0673(2006)04-0364-04
收稿时间:2006-08-31
修稿时间:2006-08-312006-10-17

Analysis and Simulation on Integrity of GHz Serial Signal in High-Speed PCB Design
LU Ping,DU Xiao-ning,LAN Ju-long.Analysis and Simulation on Integrity of GHz Serial Signal in High-Speed PCB Design[J].Journal of Information Engineering University,2006,7(4):364-367.
Authors:LU Ping  DU Xiao-ning  LAN Ju-long
Affiliation:1. Institute of Information Engineering, Information Engineering University, Zhengzhou 450002, China; 2. Political Department, Information Engineering University, Zhengzhou 450002, China
Abstract:The new problems about signal integrity such as skin effect,dielectric loss and inter-symbol interface brought by high-speed serial signal whose frequency is of the order of GHz are analyzed in detail in this paper,the effect of this problems about signal integrity on SI simulation is given,a method for solving the problems about GHz signal integrity is presented,and its effectivity is validated with reference to an example.
Keywords:SERDES  signal integrity  loss  pre-emphasis  eye diagram
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