| 次亚磷酸钠作为还原剂的化学镀镍 |
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| 引用本文： | 潘卫东,洪鹤,陈立佳.次亚磷酸钠作为还原剂的化学镀镍[J].沈阳工业大学学报,1997(6). |
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| 作者姓名： | 潘卫东 洪鹤 陈立佳 |
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| 摘 要： | 介绍了次亚磷酸钠作为还原剂的化学镀镍的原理，镀液组成及镀层性能特点．并对影响镀覆的各种因素进行了讨论．
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| 关 键 词： | 化学镀 镍基金属 次亚磷酸钠 |
Electroless Plating of Ni P Using Hypophosphite as Reducing Agent |
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| Pan Weidong,Hong He,Chen Lijia.Electroless Plating of Ni P Using Hypophosphite as Reducing Agent[J].Journal of Shenyang University of Technology,1997(6). |
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| Authors: | Pan Weidong Hong He Chen Lijia |
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| Affiliation: | Dept. of Metal Material Engineering |
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| Abstract: | This paper introduces the principle, solution composition and layer performance of electroless plating of Nickkel using hypophosphite as reducing agent, and discusses the various factors affecting the plating |
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| Keywords: | electroless plating nickel base alloy reducing agent |
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