| 生瓷带冲孔工艺设备应用及发展趋势 |
| |
| 引用本文： | 张晓云,;唐卓睿. 生瓷带冲孔工艺设备应用及发展趋势[J]. 电子工业专用设备, 2014, 0(5): 1-6 |
| |
| 作者姓名： | 张晓云, 唐卓睿 |
| |
| 作者单位： | [1]中国电子科技集团公司第十三研究所,河北石家庄050051; [2]北京理工大学自动化学院,北京100081 |
| |
| 摘 要： | 主要对(应用于LTCC和HTCC)生瓷带冲孔工艺的特性以及几种主要的冲孔设备应用的现状和发展趋势进行了论述。且分析了生瓷带冲孔设备应该具备的高位置精度、边缘精度和高冲孔速度。同时研究了气动冲孔机和激光冲孔机在生瓷带冲孔工艺中的应用和发展趋势。
|
| 关 键 词： | 生瓷带 气动冲孔 激光冲孔 |
The Application and Development Trend of Green Ceramic Tape Punching Process Equipment |
| |
| Affiliation: | ZHANG Xiaoyun TANG Zhuorui (1. The 13^th Research Institute of CETC, Shijiazhuang 050051, China; 2. School of Automation, Beijing institute of Techonology, Beijing 100081, China) |
| |
| Abstract: | This paper described the punching process characteristics （used in LTCC and HTCC technology） of green tape punching process, summarized the application status and development trend of several major punching device, and analyzed high positional accuracy, edge precision and high punching speed that the green tape punching device should have, and discussed the application and development trend of pneumatic punching machine and laser punching machine in the green tape punching process. |
| |
| Keywords: | green tape pneumatic punching laser punching |
| 本文献已被 CNKI 维普 等数据库收录！ |
|
