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设计了用于半导体先进封装光刻设备中的高精度机器视觉对准测量系统,明确了机器视觉对准测量系统工作原理、设计指标及系统设计中需要考虑的关键技术点,同时给出了机器视觉对准测量系统关键零部件的设计,并给出了对准测量系统最终在整机上测得的性能数据。测试结果表明,所设计的机器视觉对准测量系统完全可以满足集成电路先进封装工艺需求。

High Precision Machine Vision Alignment Measurement System Design

this article designed high precision machine vision measurement system for semiconductor advanced packaging lithography equipment, it has been clear about the aim machine vision measuring system working principle, design speciafications and key technical points to consider in the design of the system, and gives the aim machine vision measuring system design of key parts, and give the final test data of alignment measuring system on the lithography equipment. Test results show that the design of the machine vision alignment measurement system can completely meet the demand of integrated circuit advanced packaging process.