| 化学镀镍在微电子领域的应用及发展前景 |
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| 引用本文： | 贾韦,宣天鹏. 化学镀镍在微电子领域的应用及发展前景[J]. 稀有金属快报, 2007, 26(3): 1-6 |
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| 作者姓名： | 贾韦 宣天鹏 |
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| 作者单位： | 合肥工业大学,安徽,合肥,230009 |
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| 摘 要： | 介绍了化学镀镍工艺的基本原理、化学镀镍合金层的物理和化学性质及其研发现状。重点阐述了化学镀镍技术在微电子领域的应用，包括UBM制作、印制电路板表面终饰工艺和LCR元件制造，以及在计算机存储领域的应用。指出，减少污染、延长镀液使用寿命、降低成本仍然是化学镀镍面临的一项长期的任务；其在微电子领域中的镍镀层的多功能化、镀层高密度化存储、纳米微粒掺杂新型功能性镀层等更深层次的需求有着广阔的发展前景。
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| 关 键 词： | 化学镀镍 微电子 计算机存储 |
| 文章编号： | 1008-5939(2007)03-001-06 |
| 修稿时间： | 2006-10-08 |
Application of Electroless Ni in Microelectronic Filed |
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| Jia Wei,Xuan Tianpeng. Application of Electroless Ni in Microelectronic Filed[J]. Rare Metals Letters, 2007, 26(3): 1-6 |
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| Authors: | Jia Wei Xuan Tianpeng |
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| Abstract: | The fundamental,physical and chemical properties of electroless Ni are presented in the paper.The application and prospect of electroless Ni plating in the field of microelectronic device and computer storage are described.Some typical applications in under bump metallurgy(UBM)for flip chip bumping,PC boards,LCRs and computer hard disk are reviewed.It was pointed out the objective in the future is reducing pollution,prolonging the service life,and cutting down the cost. |
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| Keywords: | electroless Ni microelectronic computer storage |
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