某星载电子设备的力学仿真分析

星载电子设备面临着各种严酷的力学环境，具有极高的可靠性要求。文中为了节省环试成本，缩短研发周期，采用ANSYS建立了某星载电子设备的力学仿真模型；为了验证模型的准确性，进行了该电子设备的模态仿真及实测，经过比较发现两者数据非常接近；基于建立的仿真模型，分析了该电子设备在加速度过载、冲击、正弦振动及随机振动等各种工况下的结构响应和受力情况，得到了相应的位移和应力云图。结果表明该电子设备的结构设计满足星载环境要求。文中针对该电子设备的结构仿真及测试对于理解其力学特性具有重要的意义。

Mechanical Simulation Analysis of a Space-borne Electronic Equipment

Extremely high reliability for the space-borne electronic equipment is required for it has to face various severe environments during the launching stage and in the space. In order to reduce the cost of environmental tests and shorten the development cycle, the mechanical simulation model of a certain space-borne electronic equipment is established by ANSYS software. Modal simulation and test are both carried out to verify the simulation model. The result shows that the simulation data and test data are almost the same. Based on the simulation model, the acceleration overload, impact resistance, sinusoidal vibration and random vibration performance of the electronic equipment are analyzed and the corresponding mechanical response data such as deformation and stress are obtained. The result shows that the mechanical design of the electronic equipment satisfies the strength requirement in the space-borne environment. The mechanical simulation and test in this paper are very helpful for understanding the mechanical characteristics of the space-borne electronic equipment.