| 基于EBG结构的高阻抗反射背板研究 |
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| 引用本文： | 柏宁丰,陈令尧,樊鹤红,薛明,孙小菡. 基于EBG结构的高阻抗反射背板研究[J]. 电子器件, 2010, 33(6). DOI: 10.3969/j.issn.1005-9490.2010.06.017 |
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| 作者姓名： | 柏宁丰 陈令尧 樊鹤红 薛明 孙小菡 |
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| 作者单位： | 东南大学电子科学与工程学院光子学与光通信研究室,南京,210096;东南大学电子科学与工程学院光子学与光通信研究室,南京,210096;东南大学电子科学与工程学院光子学与光通信研究室,南京,210096;东南大学电子科学与工程学院光子学与光通信研究室,南京,210096;东南大学电子科学与工程学院光子学与光通信研究室,南京,210096 |
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| 摘 要： | 提出一种带缺陷结构的圆形贴片六角晶格EBG结构,构建宽带高阻抗反射背板.通过数值仿真软件CST,对正方晶格方型贴片、六角晶格圆形贴片以及带缺陷结构的高阻抗反射背板的带隙特性进行对比.实验制作了基于陶瓷基板的三种EBG结构高阻抗反射背板,实测得到正方形晶格贴片、六角晶格圆形贴片和缺陷型圆形贴片背板结构的带宽分别为1.68 GHz、1.98 GHz和2.24 GHz.实验结果与仿真结果相吻合,表明带缺陷六角晶格圆形贴片EBG高阻抗表面相比于原有结构,在带隙特性方面具有更好的优势.
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| 关 键 词： | EBG结构 蘑菇型结构 带宽 容差 |
High Impedance Ground Plane Based on Electromagnetic Band Gap Surface |
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| BAI Ningfeng,CHEN Lingyao,FAN Hehong,XUE Ming,SUN Xiaohan. High Impedance Ground Plane Based on Electromagnetic Band Gap Surface[J]. Journal of Electron Devices, 2010, 33(6). DOI: 10.3969/j.issn.1005-9490.2010.06.017 |
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| Authors: | BAI Ningfeng CHEN Lingyao FAN Hehong XUE Ming SUN Xiaohan |
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| Abstract: | A high impedance ground plane based on a mushroom-like hexagonal lattice Electromagnetic Band Gap (EBG) surface with defect is proposed. The band gaps of the ground plane based on three types EBG surface are compared by the numerical simulations.The square lattice with square patch, the hexagonal lattice with circle patch and the circle patch with defect are fabricated and the band gaps of these ground plane are measured. The results show that the bandwidth of these ground planes is 1.68GHz, 1.98GHz and 2.24GHz respectively. The large bandwidth of the defect structure is shown by our numerical and experiment results. |
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| Keywords: | EBG structure mushroom structure band width defects tolerance |
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