微加工硅表面基于AFM的纳米压痕测量与分析

原子力显微镜 (AFM )在完成对单晶硅的微加工后 ,其金刚石针尖被用做一个纳米压痕头以实现微加工区域内外机械性质的测量与分析。结果表明 ,以安装有金刚石针尖的AFM在经过化学机械抛光的硅基片上所进行的微加工 ,即使使用极小的切削力也会在加工表面形成变质层 ,但是其厚度值要小于化学机械抛光的硅表面变质层。由AFM测量的纳米级硬度值要大于由传统的Vickers和Hysitron硬度测试仪所测量的值。另外 ,随着AFM压入载荷的减小 ,纳米级硬度值呈现出增加的趋势 ,这是由于在很小的压入载荷下所呈现出的压痕尺寸效应所导致

Investigation of AFM-based nano-indentation on micro-machined silicon surface

Atomic force microscope (AFM) could be used as a micro machining tool if it is equipped with a diamond tip instead of a normal imaging tip. Alternatively the AFM diamond tip could also be used as a nano indenting tool following the micro machining process in realizing the measurement of the mechanical properties inside and outside the micro machined region. The results show that for the AFM based micro machining with a diamond tip on chemical mechanical polished silicon wafer, the deformed layer could be formed even under very small machining force, however it is smaller than the deformed layer formed by means of chemical mechanical polishing. The nano scaled hardness values of silicon measured by AFM are bigger than the hardness values measured by traditional Vickers and Hysitron indenting tester. In addition, as the indenting loads decreases, the nano scaled hardness values present a trend of increasing, which was considered due to the indenting size effect under very small indenting loads.